bonder from F & K DELVOTEC is an ultrasonic wedge-wedge
automatic bonder specially designed for processing thin
aluminium wire of 1 mil to 5 mil (25 um - 125 um). This
machine is developed for hybrid applications and is
fitted with a rotary head that turns through 440°
to make bonds in any particular orientation.
central microprocessor system controlling all the machine's
functions is connected to the "eye" of the
bonder, an intelligent, video-supported high-speed positioning
system (PRS), allowing fully automatic production with
operator enjoys optimum operating convenience due to
direct access to an extensive selection of different
program options. In addition, all necessary programming
measures are supported by an interactive, on-screen
learning mode. This modern and convenient method of
operator guidance results in cost reductions due to
shorter personnel training periods and higher productivity
due to confident operation.
special design of the bonding head and workholder, the
ability to program all relevant parameters as well as
a wide range of versatile accessories ensure maximum
flexibility in adapting the unit to a diversity of material
specifications and production requirements.
variety of uses for this bonder are not restricted to
its versatility also makes it a universal tool in all
standard types of use.
head automatic bonder
rotary head bonder Model 6310 is a fully automatic unit
that can process thin aluminium wire with a diameter
of I mil - 5 mil (25 um - 25 um)
axes are driven by stepping motors controlled by a central
microprocessor system. The bonding head is moved by
a X-Y table. The rotating movement is made by the rotary
head fitted to the bonding head. The substrate is moved
on the Z axis by an elevating platform (Z - table) thus
bringing the bonding wire and substrate in contact.
high-speed, video-supported positioning system operates
together with the process computer in automatic mode.
This system records a single pattern of the substrate
to be processed and compares the position of the pattern
structure with the position of the corresponding reference
pattern (taken from a master substrate). The geometrical
deviation on the X and Y axes of the actual pattern
in relation to the reference pattern is calculated and
signaled to the computer, which then carries out a corresponding
position correction of the bonding head. The memory
of this positioning system can store 64 (optionally
220) different reference patterns. Any source and destination
point can be programmed:
height positions - focus, bonding and loop heights -
are stored during programming and automatically accessed
by the machine during production.
machine can process substrates up to a height of 12
mm (optional 20 mm).
the height and the shape of the loop can be programmed
individually for each wire bond; the machine already
features a variety of different loop shape programmes.
overrun distance of the Z table following the wedge's
contact with the substrate (touch down), is also freely
weight can be individually programmed for both source
and destination bonds.