Delvotec 6320  

Delvotec 6320

Model 6320

This bonder from F & K DELVOTEC is an ultrasonic wedge-wedge automatic bonder specially designed for processing thin aluminium wire of 1 mil to 5 mil (25 um - 125 um). This machine is developed for hybrid applications and is fitted with a rotary head that turns through 440° to make bonds in any particular orientation.


The central microprocessor system controlling all the machine's functions is connected to the "eye" of the bonder, an intelligent, video-supported high-speed positioning system (PRS), allowing fully automatic production with maximum output.


The operator enjoys optimum operating convenience due to direct access to an extensive selection of different program options. In addition, all necessary programming measures are supported by an interactive, on-screen learning mode. This modern and convenient method of operator guidance results in cost reductions due to shorter personnel training periods and higher productivity due to confident operation.


TheThe special design of the bonding head and workholder, the ability to program all relevant parameters as well as a wide range of versatile accessories ensure maximum flexibility in adapting the unit to a diversity of material specifications and production requirements.


The variety of uses for this bonder are not restricted to hybrid applications;
its versatility also makes it a universal tool in all standard types of use.

Rotary head automatic bonder

The rotary head bonder Model 6310 is a fully automatic unit that can process thin aluminium wire with a diameter of I mil - 5 mil (25 um - 25 um)

Digital 4-axis control

All axes are driven by stepping motors controlled by a central microprocessor system. The bonding head is moved by a X-Y table. The rotating movement is made by the rotary head fitted to the bonding head. The substrate is moved on the Z axis by an elevating platform (Z - table) thus bringing the bonding wire and substrate in contact.

Positioning system

A high-speed, video-supported positioning system operates together with the process computer in automatic mode. This system records a single pattern of the substrate to be processed and compares the position of the pattern structure with the position of the corresponding reference pattern (taken from a master substrate). The geometrical deviation on the X and Y axes of the actual pattern in relation to the reference pattern is calculated and signaled to the computer, which then carries out a corresponding position correction of the bonding head. The memory of this positioning system can store 64 (optionally 220) different reference patterns. Any source and destination point can be programmed:

Bonding options

- Die-to-substrate
- Substate-to-die
- Substrate-to-substrate
- Stitch-bonds


All height positions - focus, bonding and loop heights - are stored during programming and automatically accessed by the machine during production.

Substrate heights

The machine can process substrates up to a height of 12 mm (optional 20 mm).


Both the height and the shape of the loop can be programmed individually for each wire bond; the machine already features a variety of different loop shape programmes.


The overrun distance of the Z table following the wedge's contact with the substrate (touch down), is also freely programmable.

Bond weight

Bond weight can be individually programmed for both source and destination bonds.

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